Abstract

Here, we demonstrate bulk silicon light emitting diodes operating over the 1.2–1.35μm range. This is achieved by the implantation of the rare earth thulium, incorporated in the trivalent Tm3+ state, into silicon p-n junctions. Light emitting diodes operating under forward bias have been obtained by codoping of boron to reduce the thermal quenching. Seven sharp lines are observed, corresponding to known internal Tm3+ transitions in the manifold from the H53 to the H63 ground states. This center, together with the basic 1.15μm silicon emitters and Si:Er devices operating at 1.54μm, now enables significant coverage of the extended (1.1–1.8μm) optical communications band in silicon.

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