Abstract

We studied the electroluminescence of boron-implanted p–n junction silicon light emitting-diodes (Si LEDs) engineered with the implant-induced extended defects of different types. By varying the post implant annealing conditions to tune the extended defects and by using plan-view transmission electron microscopy to identify them, we found that {113} defects along Si〈110〉 are the ones that result in strong silicon light emission of the p–n junction Si LEDs other than {111} perfect prismatic and {111} faulted Frank dislocation loops. The electroluminescence peak intensity at about 1.1eV of {113} defect-engineered Si LEDs is about twenty-five times higher than that of dislocation defect-engineered Si LEDs.

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