Abstract

We report on the one-step formation of an efficient Si homojunction solar cell produced by a simple exposure of p-type Si wafers to low-temperature inductively coupled hydrogen plasma. The formation of oxygen thermal donors during hydrogen plasma treatment is responsible for the conductivity type conversion and the final formation of Si homojunction. The hydrogen plasma etching with suppressed heavy ion bombardment results in a relatively flat surface, which is favourable for deposition of passivation layers such as silicon nitride. The integrated Si homojunction solar cell consisting of Al/p-c-Si/n-c-Si/SiN/Al-grid has demonstrated a maximum photovoltaic conversion efficiency of 13.6%.

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