Abstract
Review: The use of Si1–xGex in microelectronics production is appealing not only because it is compatible with existing industrial technology used for the production of silicon‐based microelectronics, but also because the induced strain caused by insertion of a layer of Si1–xGex(see Figure) can significantly improve their performance. The production and properties of these new materials are reviewed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
