Abstract
A simple approach to fabricate periodic arrays of conical bumps on silicon (Si) substrate is reported. In the process, a single pulse from a 200fs laser at 387nm wavelength was applied on a self-assembled monolayer of 700nm and 390nm diameter silica spheres on a n-doped Si (100) wafer. The surface was irradiated at normal incidence by immersing the silicon substrates in a glass container filled with 1, 1, 2 trichlor-trifluorethan liquid precursors. After laser irradiation, at laser fluences in the range from 1 to 40J/cm2, a regular array of conical Si bumps was fabricated. The density of the Si bumps can be varied by varying the particle size diameter. The influence of the medium on the near-field interactions for both sizes silica particles layer is investigated.
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