Silicon Based System-in-Package : a new technology platform supported by very high quality passives and system level design tools

Abstract

The very large development of home and domestic electronic appliances as well as portable device has led the microelectronics industry to evolve in two complimentary directions: More Moore with the continuous race towards extremely small dimensions hence the development of SoCs (system on chip) and more recently a new direction that we could name More than Moore with the integration of devices that were laying outside the chips and thus the creation of SiPs (system in package). The technology platform presented here is named silicon based system in package. This new platform is based upon the integration of passive devices into silicon. The four critical elements of this technology will be discussed in detail: passive integration, advanced packaging, new IC design development tools, and innovative testing