Abstract
Two-component films including nanosized silicalite-1 zeolite and acryl latex were deposited on silicon wafers via spin-coating approach. The first stage of the preparation included spin-on of as-synthesized or purified colloidal zeolite suspensions of silicalite-1 (MFI-type topology) nanoparticles with sizes of 30 and 60nm. After calcination of the zeolite films a layer of acryl latex was deposited. The porous silicalite-1/polymer films have high mechanical stability and dielectric constant in the range of 2.0–2.5. The porous nature, thickness and disorientation of the silicalite-1/polymer nanoparticles forming the films determine them as very promising low dielectric constant materials useful as insulating films in microelectronics.
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