Abstract
In this work, device degradation of metal oxide (MO) thin-film transistors (TFTs) under positive bias stress, linear stress, and saturation stress is systematically investigated. A significant degradation reduction in InGaZnO TFTs is observed for the first time under saturation stress. Incorporated with electric field simulations and temperature simulations, a degradation model, considering the interaction of ionized oxygen vacancy redistribution, self-heating effect, and hot carrier effect, is tentatively proposed to understand the degradation behaviors under various stress combinations. Moreover, a similar degradation reduction phenomenon is also reproduced in InSnZnO TFTs, demonstrating the applicability of the proposed degradation model in MO TFTs.
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