Abstract
AbstractWith advancements in microelectronics, interest in electromagnetic interference and compatibility in high‐speed circuits has greatly increased in the engineering community, and application of computational electromagnetics to electromagnetic interference and compatibility (EMI/EMC) engineering has become an emerging technology. Termination, via, and crosstalk on interconnection lines raises EMI problems in high‐speed circuits and requires attention during design phases for signal integrity. This paper analyzes signal propagation effects among different parts of high‐speed interconnection lines using the finite‐difference time‐domain (FDTD) method. The mechanism and the effectiveness of control measures are examined, which can be applied to high‐speed circuit designs. © 2002 Wiley Periodicals, Inc. Microwave Opt Technol Lett 35: 416–420, 2002; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.10624
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