Abstract
In this paper we will discuss the challenges of circuit design for high-speed and high-volume optical interconnect and how SiGe BiCMOS technologies are best suited to address these challenges. Advantages of SiGe BiCMOS are illustrated through examples of design requirements from optical front-ends (transimpedance amplifier (TIA) and modulator and laser driver) to clock and data recovery (CDR) and serializer and deserializer (SerDes). We will also look ahead to the future and predict product evolution and key requirements of optical interconnects and define the required performance of SiGe BiCMOS technology to address such specifications.
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