Si-DLC膜とPMMAまたはPEEK部材との付着・剥離試験における付着力増加要因の調査

Abstract

In order to reduce the peel resistance of molded resin from molds by applying hard thin films, we investigated the factors that cause the large peel resistance between Si-DLC and PEEK, against the background of the growing need for super engineering plastics in CFRTP molding. In the previous study, the peel resistance between Si-DLC and PEEK was about 20 times higher than that between Si-DLC and PMMA in the adhesion-peel test with a temperature history in which the resin was melted, and the reason was thought to be the difference in bond strength and the increase in bond strength due to oxidation of Si-DLC. In the adhesion-peeling test without melting the resin, the difference in bond strength and the increase in bond strength due to oxidation of Si-DLC should contribute to the increase in peel strength. Therefore, we conducted adhesion-peel tests without melting resin and without temperature history using Si-DLC and PEEK, and considered the possibility that these factors may be responsible for the increase in peel strength. Experimental results showed that peel between PEEK and Si-DLC generates lower peel resistance than between PMMA and Si-DLC, as long as there is no melting and resolidification process.