Abstract
AbstractThe design of multifunctional materials with good thermophysical and electromagnetic shielding properties is desirable to overcome overheating and electromagnetic interference (EMI) in electronic devices. In this study, three‐dimensional (3D) continuous SiC skeleton‐reinforced highly oriented graphite flake (GF@SiC) composites were fabricated by combining molten salt synthesis, heat treatment, and spark plasma sintering. When the SiC content was higher than 9 vol.%, a 3D continuous SiC skeleton was formed, which effectively constrained the cross‐plane thermal expansion of the GF@SiC composites. Highly oriented GFs endowed the composites with good thermal conductivity (TC) along the basal plane and effective EMI shielding in the X‐band. The composites with SiC concentrations of 9 vol.% exhibited an optimal comprehensive performance with a high TC of 322 W/m/K in the basal plane direction, a low thermal expansion value of 10.5 × 10−6/K in the through‐plane direction, and EMI shielding effectiveness of 36 dB. Our strategy provides a promising and practical approach for realizing graphite‐based composites to meet the current demands for electronic devices.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
