Abstract
The orthodontic bracket placement has known two major improvements these last fifty years: first with the ability of bonding brackets directly on the enamel (Newmann 1965); second with the indirect bonding procedure introduced by Silvermann and Cohen in 1972. If we put aside the technological evolutions of bonding materials (brackets and adhesives), few refinements have occurred regarding the protocols in this period of time. Furthermore, direct bonding procedure seems to be used by a majority of orthodontists despite the rapidity, accuracy and ergonomics promised by indirect bonding protocol. The main originality of the system detailed in this article is to bond orthodontic brackets in a virtually predetermined position with indirect bonding advantages but with the efficiency of direct bonding because the adhesive is applied directly on the bracket base without pre-bonding necessity. This innovation has been allowed by the use of up-to-date CFAO technology. The article first describes the two components of the SIBSystem (SIBClip and SIBTray) and details the manufacturing stages. The clinical use is then evoked as well as the cautions and limits of this innovative bonding system.
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