Si and Si/P implants in In0.5Ga0.5P and In0.5Al0.5P

Abstract

Si and Si/P ion implantation doping of In0.5Ga0.5P and In0.5Al0.5P has been studied for several Si and P doses at energies of 90 and 100 keV, respectively. For single Si implants in InGaP a maximum Hall sheet electron concentration of 1.33×1013 cm−2 is achieved for a Si dose of 5×1013 cm−2. When an optimum dose (2.5×1013 cm−2) P coimplant is performed this electron concentration is increased by 65%. The same dose Si implants in InAlP show a maximum effective activation of 3.9% with no P coimplantation and 5.2% with a P-implant dose 1.5 times the silicon dose. The apparent donor ionization energies are estimated from variable temperature Hall measurements to be 2–5 meV for InGaP and ∼80 meV for InAlP. The deeper level in InAlP is attributed to the DX level found in the Al-containing material. The reduction in sheet resistance associated with the use of Si/P coimplantation in InGaP containing heterostructures should contribute to significant performance enhancements in HFETs and lasers.