Abstract
A 3D Monte Carlo (MC) device simulation model is developed for the treatment of discrete random dopant distribution in sub-100 nm MOSFET. The electron–ion (e–i) interaction model is based on a suitable description of long-range Coulomb interaction included by a particle–mesh (PM) calculation method and short-range interaction taken into account by a scattering mechanism. Attention is given to the correct definition of the short-range domain and scattering model. This new approach is validated by computing the low-field electron drift mobility in Si by means of MC simulation of 3D resistors in the doping concentration range of 10 15–6.4×10 19 cm −3. A good agreement is found between calculation and experimental data at 300 K.
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