Short minority carrier lifetimes in highly nitrogen-doped 4H-SiC epilayers for suppression of the stacking fault formation in PiN diodes

Abstract

We investigated the dependency of minority carrier lifetimes on the nitrogen concentration, temperature, and the injected carrier concentration for highly nitrogen-doped 4H-SiC epilayers. The minority carrier lifetimes greatly shortened when the nitrogen concentration exceeded 1018 cm−3 through enhancing direct band-to-band and Auger recombination and showed a slight variation in the temperature range from room temperature (RT) to 250 °C. The epilayer with a nitrogen concentration of 9.3 × 1018 cm−3 exhibited a very short minority carrier lifetime of 38 ns at RT and 43 ns at 250 °C. The short minority carrier lifetimes of the highly nitrogen-doped epilayer were confirmed to maintain the values even after the subsequent annealing of 1700 °C. 4H-SiC PiN diodes were fabricated by depositing a highly nitrogen-doped epilayer as a “recombination enhancing layer” between an n− drift layer free from basal plane dislocations and the substrate. The PiN diodes showed no formation of stacking faults and no increase in forward voltage during current conduction of 600 A/cm2 (DC), demonstrating that a highly nitrogen-doped buffer layer with a short minority carrier lifetime successfully suppresses the “bipolar degradation” phenomenon.