Abstract
Based on the high pressure equation of state (EOS) and atomic statistical model, the influence of the electronic thermal motion on the shock compression behavior of the material are investigated. The parameter R is derived according to the high pressure equation of state Wu-Jing model. Meanwhile, the high pressure EOS for the porous metals with the effect of electronic thermal motion is proposed. Taking Cu material and the typical mixed material W/Cu alloy as the examples, the shock compression behavior are calculated under different porosity. Compared with results without the effect of electronic thermal motion, it shows that the influence can be ignored under low pressure and low porosity. With the enhancement of pressure and porosity, the effect of electronic thermal motion becomes obvious.
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