Abstract
High Density Advanced Package Design – or HDAP – continues to show remarkable advantages over monolithic SoC. Foundries and OSATs are teaming to provide manufacturing capabilities including FOWLP and various derivatives suitable for RF, IoT, automotive and mobile products or SI 3D 3DIC designs typically used in today's advanced memory and GPU/CPU applications. As HDAP manufacturing advances, so does design complexity requiring clearly defined and understood design methodologies. After providing an analysis the key steps to perform complex HDAP design including component aggregation, assembly and system optimization and design verification, this paper will highlight the requirement for a “shift-left” design environment where verification steps including LVS & LVL, thermal, power and signal integrity are performed interactively during the system integration and optimization and not left to after design completion.
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