Abstract
This paper deals with the analysis of layered structures under thermal and electro-mechanical loads. Constitutive equations for multifield are considered and the Principle of Virtual Displacements (PVD) is employed to derive the governing equations. The MITC9 shell finite element based on the Carrera's Unified Formulation (CUF) has been applied for the analysis. The models grouped in the CUF have variable through-the-thickness kinematic and they provide an accurate distribution of displacements and stresses along the thickness of the laminate. The shell element has nine nodes and the Mixed Interpolation of Tensorial Components (MITC) method is used to contrast the membrane and shear locking phenomenon. The finite element analysis of multilayered plates and shells has been addressed. Variable kinematics, as well as layer-wise and equivalent single layer descriptions, have been considered for the presented FEs, according to CUF. A few problems are analyzed to show the effectiveness of the proposed approach. Various laminations, thickness ratios and curvature ratios are considered. The results, obtained with different theories contained in the CUF, are compared with both the elasticity solutions given in literature and the analytical solutions obtained using the CUF and the Navier's method.
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