Abstract
The shear strength and aging characteristics of 63Sn–37Pb solder bumps were characterized with variation in solder ball and UBM pad sizes. The shear strength increased with shorter effective crack size,aeffs which was determined with the solder ball and pad sizes. The shear strength of the solder bumps on Au/Ni/Cu and Ni/Cu did not change significantly with reflow time. Substantial decrease in the shear strength occurred for the solder bumps formed on Au/Ni/Cu with aging treatment, and the shear strength after aging was also related to the bump shape which was determined with the solder ball and pad sizes.
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