Abstract
The use of Pb-free solder alloys are just newly developed materials and their properties are not well established and documented yet. So, the research to substitute the critical problem of the Pb solder alloy are increasing widely. To evaluate the shear property of solder joints according to temperature condition was predicted through the Shear-Punch test and FEM. By using the database according to this, the reliability evaluation technology of the solder joints tries to be formulated. In this paper, the solder used the Sn37Pb, Sn-4Ag and the Sn4Ag0.5Cu. When solder melted in the copper interface, the solder joints according to reflow times, each modeling required for the Shear- Punch was made in consideration of the IMC layer thickness. And the micro shear punch test was performed to obtain material properties of solder according to temperature condition. The shear properties of specimen which was modeled was predicted through FEM. It compared with the test value in which it obtains from Shear-Punch. Also, a method which can obtain shear properties of Pb-free solder joints easily and quickly using FEM was proposed.
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