Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests

Abstract

The shear deformation behavior of two lead-free solder compositions, Sn-3.5Ag (wt.%) and Sn-3.6Ag-1.0Cu (wt.%), both on copper substrates, was studied using an asymmetric four point bend technique. Four test joints were obtained from one master specimen of each composition, and each joint was subject to progressive loading, up to the maximum shear strength of the joint. One unstressed bar from each composition was retained as a reference. Each sample was metallo-graphically plished and lightly etched, and examined in a field emission scanning electron microscope (SEM) before shearing. Sheared joints were then re-examined in the SEM with no additional surface treatment. Compared with the traditional ring and plug method, the asymmetric four-point bend (AFPB) technique subjects the joints to a condition of pure shear, while providing an opportunity for unambiguous observation of microstructural features before and after shearing, without an intervening mechanical sectioning step. Shear banding in the Sn-rich matrix and crack nucleation in the vicinity of the intermetallic interface were observed at low displacements in the binary alloy. Evidence of non-homogeneous plastic flow in the matrix was seen at higher shear loading. No evidence of brittle fracture was observed in the Sn-3.6Ag-1.0 Cu alloy, with elastic deformation at low stress levels giving rise to plastic deformation at higher loading values. Results show that the AFPB technique is a viable approach to the study of shear loading on solder joints.