Abstract
In this study, shear tests have been performed on the as-reflowed Sn3.5Ag solder bumps and joints to investigate the deformation behavior of Sn3.5Ag lead-free solder samples. Scanning electron microscopy (SEM) was employed to characterize the microstructures of the samples and orientation imaging microscopy (OIM) with electron backscattered diffraction (EBSD) in SEM was used to obtain crystallographic orientation of grains to provide a detailed characterization of the deformation behavior in Sn3.5Ag solder samples after shear tests. The deformation behavior in solder samples under shear stress was discussed. The experimental results suggest that the dynamic recrystallization could occur under shear stress at room temperature and recrystallized grains should evolve from subgrains by rotation. Compared with that of non-recrystallized and as-reflowed microstructures, the microhardness of the recrystallized microstructure decreased after shear tests.
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