Abstract
A novel strategy is proposed to design microstrip antenna arrays with two wide bands for high frequency applications using any-layer HDI PCB technology. This technology makes it possible to stack multiple layers of substrates and micro-vias. Several antennas are designed and taped out to illustrate the new procedure. The antennas cover two wide frequency bands with a large separation ratio of 2.2:1, from 28 to 30 GHz and from 57 to 71 GHz. Measurement results show a matching better than 10 dB over both bands, and an intra-band coupling lower than -28 dB. Measured gains and radiation patterns for the arrays all show a good agreement with simulations.
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