Abstract
Active disassembly (AD) uses innovative materials that can perform a designed disassembly action by the application of an external field. AD provides improvements over current disassembly processes by limiting machine or manual labor and enabling batch processing for end-of-life products. With improved disassembly operations, more reuse of components and purer recycling streams may be seen. One problem with AD, however, has been with the single-field actuation because of the probability of accidental disassembly. This presentation will discuss the application of shape memory polymer (SMP) nanocomposites in a new AD process. This novel AD process requires multiple-field actuation of the SMP nanocomposite fastener. In the analysis of this AD process, thermal and magnetic field tests were performed on the SMP nanocomposite. From these tests, finite-element analysis was performed to model and simulate the multiple-field AD process. The results of the simulations provide performance variables for the AD process and show a better performance time for the SMP nanocomposite fastener than for a comparable SMP fastener.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
