Abstract
The shape memory behaviours of Ti51.4Ni25.2Cu23.4, Ti51.3Ni21.1Cu27.6, Ti51.2Ni15.7Cu33.1 and Ti51.4Ni11.3Cu37.3 thin films annealed at 773, 873 and 973K for 1h were investigated. The Ti51.3Ni21.1Cu27.6 film annealed at 773K, the Ti51.2Ni15.7Cu33.1 film annealed at 873K, and the Ti51.4Ni11.3Cu37.3 films annealed at 873 and 973K showed a perfect shape memory effect at a stress as high as 1GPa. This improvement in shape memory behaviour was attributed to their fine grain sizes less than 500nm. Whereas the Ti51.2Ni15.7Cu33.1 and Ti51.4Ni11.3Cu37.3 films annealed at 873K or higher showed a martensitic transformation start temperature above room temperature, these films annealed at 773K were in the parent phase at room temperature owing to their very fine grain sizes. The effects of Cu content and annealing temperature on the shape memory behaviour of the Ti51.5Ni48.5−xCux (x>27) films with submicron grain sizes were discussed in comparison with those of the Ti51.5Ni48.5−xCux (x<24) films on the basis of their microstructures.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
