Abstract

We study the dynamics of void formation through the shape evolution of high-aspect-ratio cylindrical holes in Si(001) substrates under hydrogen annealing. We compare the observed evolution of these holes with numerical simulations based on the continuum theory for surface-diffusion-driven shape evolution. We find that a strong morphological instability arises near the hole opening, regardless of the presence of anisotropy in surface energy. The observed shape evolution of high-aspect-ratio holes during hydrogen annealing is understood as a surface-diffusion-driven evolution subject to the stability of the facets which form the vertical sidewall.

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