Sequential EDM and ECM Process

Abstract

Sequential machining is an emerging manufacturing technique that is preferred to machine advanced engineering materials with excellent machining efficiency. The generation of complex features on workpieces using conventional machining is a complex activity, whereas utilization of non-traditional machining processes for such purposes can enhance precise machining. In sequential machining, two or more machining processes whose working principle, and method of application is totally different, are performed at a single station. This condition allows reduced loading and unloading of the workpiece, as right from machining to finishing all operations are carried out at a single station. This situation permits a higher level of positioning accuracy. Sequential machining offers certain benefits such as controlled material removal, high precision, maximum material utilization, better surface finish, improved machining efficiency, and so on. The electric discharge machining (EDM) and electrochemical machining (ECM) processes are applied sequentially by considering various objectives such as improvement in the dimensional accuracy, surface characteristics of the workpiece, reduction of the overall machining time, etc. There is a stark difference in the mechanism of material removal with the EDM and ECM processes, but the kinematics of the machining are the same. Implementation of both the techniques in a sequential manner suggests numerous complementary advantages. This chapter deals with the fundamentals of sequential machining, the working principle of electric discharge machining (EDM) and electrochemical machining (ECM), the execution of the sequence, the investigation of the influences of various process parameters, the micro-structure produced and the selection of essential process parameters of EDM and ECM. Similarly, the machining capability of sequential EDM and ECM, its advantages and disadvantages, challenges, opportunities, and future perspectives have also been discussed in this chapter.