Abstract
The waste lead (Pb)-free solder leaching process in hydrochloric acid (HCl) solution with hydrogen peroxide (H2O2) followed by separation of copper (Cu) and tin (Sn) was investigated to separate tin, silver (Ag), and copper as an individual component from waste Pb-free solder. The dissolution of Sn increased with increasing temperature and HCl concentration. The concentrations of Sn and Cu increased to 27090g·m ¹3 and 191g·m ¹3 , respectively, under the leaching condition with 1kmol·m ¹3 HCl, 0.8kmol·m ¹3 H2O2 at 50°C and 400rpm for 120min, while Ag is not detected in all leaching tests. The Sn and Cu components are thus successfully separated from Ag by hydrochloric acid leaching with hydrogen peroxide. To precipitate selectively Cu ions from the leach solution, the method to add Sn powder has been investigated. Thus, 92.8g·m ¹3 (1.46mol·m ¹3 ) of Cu could be removed successfully from the leach solution with Sn under the following conditions; 30°C in temperature; 400rpm in agitation speed; 0.3mlmin ¹1 in N2 flow rate; 0.1g Sn powder addition to 100cm 3 leach solution.
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