Abstract

The employment of a large number of embedded sensors in advanced monitoring systems becomes more common, enabling in-service detection, localization and assessment of defects in mechanical, civil and aerospace structures. These sensors could be optical fibre sensors, accelerometers, strain gauges or piezoelectric wafer active sensors (PWAS). As the latter are quite popular, due to its multipurpose application as actuators and sensors and its low cost, this type will be investigated. Within this paper a possible approach of sensor performance is presented. The method uses the coupled electro-mechanical admittance to detect damage of the PWAS and its bonding layer. The help of a temperature dependent theoretical model provides for influences of changing environmental and operational conditions. The model will be compared with FEM-results, before showing the successful application on experimental results.

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