Sensitivity of on-resistance and threshold voltage to buffer-related deep level defects in AlGaN/GaN high electron mobility transistors

Abstract

The influence of deep levels defects located in highly resistive GaN:C buffers on the on-resistance (RON) and threshold voltage (Vth) of AlGaN/GaN high electron mobility transistors (HEMTs) power devices was studied by a combined photocapacitance deep level optical spectroscopy (C-DLOS) and photoconductance deep level optical spectroscopy (G-DLOS) methodology as a function of electrical stress. Two carbon-related deep levels at 1.8 and 2.85 eV below the conduction band energy minimum were identified from C-DLOS measurements under the gate electrode. It was found that buffer-related defects under the gate shifted Vth positively by approximately 10%, corresponding to a net areal density of occupied defects of 8 × 1012 cm−2. The effect of on-state drain stress and off-state gate stress on buffer deep level occupancy and RON was also investigated via G-DLOS. It was found that the same carbon-related deep levels observed under the gate were also active in the access region. Off-state gate stress produced significantly more trapping and degradation of RON (∼140%) compared to on-state drain stress (∼75%). Greater sensitivity of RON to gate stress was explained by a more sharply peaked lateral distribution of occupied deep levels between the gate and drain compared to drain stress. The overall greater sensitivity of RON compared to Vth to buffer defects suggests that electron trapping is significantly greater in the access region compared to under the gate, likely due to the larger electric fields in the latter region.