Abstract
In this paper, we report a novel and low-cost method to improve the sensitivity of a low-power 2D microelectromechanical systems thermal wind sensor by using HF wet etching. After wet etching, the thickness of the glass substrate decreases, so that the sensor’s thermal vias become more exposed to the wind. As a result, the conductive heat transfer is weakened and the convective heat transfer is enhanced in sensor operation. Finite-element method simulations verify this analysis. Moreover, the sensor chips with different lengths of silicon vias above the substrate are successfully fabricated and tested. Measurement results show that the wet etching has no influence on the metal film sensing and heating elements of the sensor. Besides, before and after wet etching for 7 and 14 min, at the wind speed of 5 m/s, the measured sensitivities of the sensor with a total power consumption of 24.5 mW are 77.2, 98.6, and 164.1 mK/(m/s). Measurement results also show that the improved sensitivity of the sensor chip can provide a more accurate measurement in wind speed but has little effect on the wind direction measurement. Instead, the accuracy of wind direction measurement is mainly related to the structural and thermal symmetries of the wind sensor. After compensation, the proposed thermal wind sensor can detect the wind direction in a full range of 360° with an mean error of 2.3° and a maximum error of 6°.
Published Version
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