Abstract
In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being undertaken to implement complex InP based application-specific photonic integrated circuits (ASPIC) with transmit and receive functionalities from a set of basic building blocks. The integration platform pursued at Fraunhofer HHI is building on semi-insulating substrate. Recently a variety of receiver-type PIC with up to 40 GHz bandwidth capability designed by external users was fabricated in multi-project wafer runs. Examples are demonstrated. Extension of this platform to include transmit functionalities is underway using an MOVPE based butt-coupling approach.
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