Semiconductor-to-metal transition in atomic layer deposition (ALD) of VO2 films using VCl4 and water

Abstract

The semiconductor-to-metal transition of vanadium dioxide (VO2) films is studied using temperature-dependent Raman, optical, and electrical measurements. The VO2 films are deposited via an atomic layer deposition (ALD) process using alternate pulses of vanadium tetrachloride and H2O at 350 °C. A growth rate of 0.021 nm/cycle and a thickness of 33 nm of VO2 are obtained for all films studied. The phase of the film is determined using x-ray diffraction. The as-deposited films are amorphous and are transformed to the monoclinic phase with a post-deposition, forming gas anneal at temperatures ≥ 500 °C for 60 min. The purity of the films is determined using x-ray photoelectron spectroscopy and no evidence of residual chlorine is detected. The temperature-dependent Raman Ag mode of the monoclinic VO2 phase is observed to monotonically decrease from 25 °C to 78 °C; where no evidence of the Ag peak is observed in the film beyond 68 °C. The refractive index and extinction coefficient extracted from temperature-dependent ellipsometry confirm that, beyond 68 °C, free carriers are generated in the film. Electrical measurements performed on a fabricated p++Si/VO2/Ti/Au device show a semiconductor-to-metal transition behavior with a high resistance of 14701 ± 2284 Ω at 62 °C and a low resistance of 1064.1 ± 143 Ω at 67 °C. This work demonstrates that a halide-based ALD process provides a clean and robust approach to synthesizing high-quality VO2 films.