Abstract
The paper reviews the challenges semiconductor cleaning technology is facing in the light of: (i) advanced silicon technology moving in the direction of non-planar device structures such as 3D MOS gates, MEMS devices as well 1D nanowire-type structures, (ii) the need for modified cleans for semiconductors other than silicon, e.g. Ge and III-V compounds, and (iii) emerging needs to process surfaces of non-semiconductor substrates such as for instance sapphire in SOS (Silicon-On-Sapphire) material systems. It is concluded that in several areas significant modifications of the established cleaning technology are needed to meet emerging challenges.
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