Abstract
We present modifications to a feature-based, image-retrieval approach for estimating semiconductor sidewall (cross-section) shapes using top-down images. The top-down images are acquired by a critical dimension scanning electron microscope (CD-SEM). The proposed system is based upon earlier work with several modifications. First, we use only line-edge, as opposed to full-line, sub-images from the top-down images. Secondly, Gabor filter features are introduced to replace some of the previously computed features. Finally, a new dimensionality reduction algorithm - direct, weighted linear discriminant analysis (DW-LDA) - is developed to replace the previous two-step principal component analysis plus LDA method. Results of the modified system are presented for data collected across several line widths, line spacings, and CD-SEM tools.
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