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Abstract

Electronics that are used in wide range of applications must operate in varying temperature and humidity environments ranging from indoor controlled conditions to outdoor climate changes. Exposure to moisture, ionic contaminants, heat, radiation, and mechanical stresses can be highly detrimental to electronic devices and may lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environment, as well as to provide handling, assembly, and electrical and thermal considerations. This chapter presents an overview to electronic packaging and plastic encapsulation. Electronic packaging consists of hermetic (ceramic or metallic) packaging or non-hermetic (plastic) encapsulation. More than 99% of microelectronic devices are plastic encapsulated. Packaging levels and encapsulated microelectronic package types including 2D and 3D packages are discussed. 2D packages are further classified into through-hole, surface-mount, or substrate packages. 3D packages can be stacked die, stacked packages, or folded packages. 3D packages have emerged in response to the demand for smaller, faster, and higher density electronics. They offer higher silicon efficiency and better performance compared to 2D packages. Encapsulation methods including molding, glob-topping, underfilling, potting, and printing are outlined in this chapter. One of the most commonly used encapsulant materials is epoxy molding compound.