Abstract
Spin-coating is an important processing technique used in several industries, whereby a centrifugal force is used to produce a uniform thickness of fluid material on a rotating surface. In particular, spin-coating is being used throughout the electronics industry to coat silicon wafers with different materials such as photoresist (semiconductor fabrication) and bump fusion fluxes (in semiconductor assembly). In this paper the spin coating process for bump fusion fluxes is examined. A mathematical model has been developed for a flux spin-coating process based on material and process variables, the results of which are then compared experimentally with data. The theoretical analysis of a spin coating process is physically and mathematically complex but nevertheless even partial analysis provides insight into the effectiveness and limitations of the process. Variables studied include viscosity, initial dispensed volume, rotational speed, and time.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
