Abstract

AbstractBone implant biomaterials are among the most used materials for clinical application. Despite significant advances in biocompatibility and osteoconductivity, conventional biomaterials lack the ability to cope with the pathological microenvironment (inflammation, infection, residual tumors, etc.) during bone repair. Semiconductor implant materials have unique electrical, optical, ultrasound, and thermal response properties, which facilitate non‐invasively and controllably dynamic repair of pathological bone defects. In this review, the design and synthesis of a new generation of semiconductor‐driven bone implant materials are summarized, the mechanism of action of semiconductive biomaterials' functional interfaces and the dynamic repair process of bone tissues are discussed, and new strategies for the problems encountered during clinical osseointegration is provided. Finally, the review outlooks the future of functional semiconductive implants for bone defect repair.

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