Abstract
The copper-based alloys studied belong to the group of those materials showing Shape Memory Effect (SME). Diffusion Bonding (DB) procedure is an alternative joining method of welding copper-based Shape Memory Alloys, traditionally welded by techniques like electron bean welding (EBW). However EBW provides embrittlement to the joint. This situation has been corrected by DB as confirm the SEM-EDS study presented here.A material shows SME when once has been thermomechanically deformed, it is able to recover its original (as fabricated) shape by means of a simple heat-up. This pheno menom is possible only for those materials which have β phase prone to undergo martensitic transformation. DB technique estimulates diffusion processes betwen materials by the combination of pressure, temperature, time, surface materials roughness and atmosphere condition in the experimental unit with the aid, sometimes, of a third material, in foil or plated form, which is known by the name of interlayer. The parameter set and details of attaing diffusion bonding joints procedure are under a patent developed recently by the authors .
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