Abstract
In this work, we developed Ga-doped Sn-based solders for the microelectronics industry. The microstructures, melting properties, wetting performance, electrical conductivities, electrochemical corrosion behaviors, and mechanical properties of the Sn–9Zn–2Bi–xGa (x = 0.05, 0.1, 0.3 and 0.5 wt%) alloys were investigated. The results indicated that Ga addition led to the disappearance of the coarse Zn-rich phase. Ga was found solubilized in the Zn phase, without the formation of intermetallic compound (IMC). Ga reduced the fusion point of the Sn–9Zn–2Bi alloy, while the pasty and undercooling range increased. Ga addition was found beneficial to the wettability of the Sn–9Zn–2Bi alloy, but increased the resistivity slightly. The ultimate tensile strength of the Ga-containing alloys was improved. The fracture was diverted from the near–completely ductile fracture to the mixed rupture feature. When Ga concentration was 0.3 wt%, the corrosion product layer of the Sn–Zn–Bi–Ga alloy was uniform and dense, which effectively prevented the alloy from further corrosion.
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