Abstract
A novel poly(arylene ether nitrile) terminated with hydroxyl groups (PEN–OH) was synthesized successfully. The effects of heat-treatment temperature on the thermal properties, mechanical properties, and dielectric properties of the PEN–OH films were studied in detail. Due to the cross-linking reaction occurring, at high temperature, among the nitrile groups on the side of the PEN–OH main chain to form a structurally stable triazine ring, the structure of materials changes from a linear structure to a bulk structure. Thus, the thermal properties and mechanical properties were improved. In addition, the occurrence of cross-linking reactions can reduce the polar groups in the material, leading to the decrease of dielectric constant. As the heat-treatment temperature increased, the glass-transition temperature increased from 180.6 °C to 203.6 °C, and the dielectric constant decreased from 3.4 to 2.8 at 1 MHz. Proper temperature heat-treatment could improve the tensile strength, as well as the elongation, at the break of the PEN–OH films. Moreover, because of the excellent adhesive property of PEN–OH to copper foil, a double-layer flexible copper clad laminate (FCCL) without any adhesives based on PEN–OH was prepared by a simple hot-press method, which possessed high peel strength with 1.01 N/mm. Therefore, the PEN–OH has potential applications in the electronic field.
Highlights
With the rapid development of consumer electronics, flexible copper clad laminate (FCCL) with high temperature, high frequency, and high transmission speed has attracted extensive research interest in the academic and commercial fields
The Poly(arylene ether nitrile) (PEN)–OH was synthesized by nucleophilic substitution polycondensation according to the previous reports [24], and the molecular weight can be adjusted by the molar ratio of BPAF to DCBN
At 2,the of the catalysis hydroxyl group, a cross-linking shown in Figure thepresence hydroxy-terminated poly(arylofether nitrile) has a linear structure before reaction will occur between the nitrile groups of ontheside of the molecular chain to form a reaction structurally being heat-treated
Summary
With the rapid development of consumer electronics, flexible copper clad laminate (FCCL) with high temperature, high frequency, and high transmission speed has attracted extensive research interest in the academic and commercial fields. Due to the presence of the nitrile groups, PEN has stronger polarizability than that of other poly(arylene ether)s, which appears to promote the adhesion of the polymers to a variety of substrates [9]. The presence of the nitrile groups makes the PEN have good adhesion to copper, so a double-layer flexible copper clad laminate can be prepared by a simple hot pressing method without binder, which will greatly reduce the dielectric loss in signal transmission and improve the thermal properties of the FCCL [10,11,12]. The PEN will provide great possibilities for flexible, high temperature resistance, high frequency and high transmission speed copper clad laminate materials
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