Abstract

In this contribution we present the results from the simulation of an AlGaN/GaN heterostructure diode by means of a Monte Carlo tool where thermal effects have been included. Two techniques are investigated: (i) a thermal resistance method (TRM), and (ii) an advanced electro-thermal model (ETM) including the solution of the steady-state heat diffusion equation. Initially, a systematic study at constant temperature is performed in order to calibrate the electronic model. Once this task is performed, the electro-thermal methods are coupled with the Monte Carlo electronic simulations. For the TRM, several values of thermal resistances are employed, and for the ETM method, the dependence on the thermal-conductivity, thickness and die length is analyzed. It is found that the TRM with well-calibrated values of thermal resistances provides a similar behavior to ETM simulations under the hypothesis of constant thermal conductivity. Our results are validated with experimental measurements finding the best agreement when the ETM is used with a temperature-dependent thermal conductivity.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call