Abstract
Diglycidyl ethers of bisphenol-A (DGEBA)/4,4′-diaminodiphenylmethane (DDM)/polyethersulphone (PES) blends were prepared as matrix resins for electrically conductive adhesives containing silver (Ag) fillers. The epoxy/PES blends formed co-continuous phase structures from initial homogeneous solutions via reaction-induced phase separation during the curing process. The Ag fillers were selectively localized in the epoxy-rich phases that had high affinity toward the surface of the Ag fillers. The co-continuous phase structures of the epoxy/PES blends acted as templates for the three-dimensional continuous structures of the Ag fillers. The self-assembled structures of the Ag fillers were connected in a continuous phase that possessed high electrical conductivity using a relatively small amount of Ag filler. In addition, the epoxy/PES/Ag adhesives had excellent shear adhesive strength. The fracture toughness of the epoxy/PES blends was the source of the high adhesive strength.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
