Abstract
Abstract The electrodeposition of copper on steel substrates has been used to produce a relative thick copper film. The resistivity and rigidity of the copper film are the key parameters for practical applications of the Fe/Cu composite. In this study, the electrodeposition of copper on steel substrate was performed at varied cathode current densities of 2∼14 A·dm − 2 . The resistivity and rigidity of the electrodeposited copper film increased with current density, while decreased with room temperature storage time due to the increase of crystal grain size and decrease of grain boundary number.
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