Self-Heating Mitigation of TreeFETs by Interbridges

Abstract

Adding interbridges (IBs) as additional channels between nanosheets (NSs) can reduce not only the maximum temperature in local hotspot of device but also the junction temperature difference among channels. The Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.98</sub> Ge <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.02</sub> IBs added into pSi NSs reduce the maximum device temperature by 9 °C and the maximum junction temperature difference among channels by 5 °C. This is attributed to the higher thermal conductivity of IBs than internal spacer (7 versus 2 W/K/m) to increase heat exchange between NSs. Further increasing the width of Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.98</sub> Ge <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.02</sub> IBs from 5 to 10 nm can cause 14 °C reduction in the maximum device temperature and 6 °C reduction in the junction temperature difference due to 1.1X enhancement of heat exchange between NSs. Increasing the height of Si <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.98</sub> Ge <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.02</sub> IBs from 20 to 30 nm can reduce the maximum device temperature by 22 °C but slightly increase the junction temperature difference by 1 °C due to 30% decrease in the heat exchange between NSs.