Abstract
AbstractFlexible stress sensors that can convert different forces into electrical signals show great potential for applications in wearable electronics and electronic skin. The integration of self‐healing capacity into stress‐sensing materials can boost their reliability, stability, and long‐term performance. There have been many reviews describing the progress of research on self‐healing stress sensors. However, most have typically investigated the self‐healing design separately from the sensing mechanism. The review focuses on how the latest advances in coupling stress‐sensing performance with dynamic chemistry balance self‐healing and sensing performance. Then, based on sensing structures and self‐healing dynamic bonds, the design strategies, and preparation methods of self‐healing sensors and their advantages and disadvantages in recent years are summarized in detail. It is anticipated that this work will provide insights and guidance for the future development of sensors with synergistically enhanced self‐healing and sensing properties and their application designs.
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