Abstract

Emerging thermal metamaterials have been deployed to realize advanced thermal field manipulations and opened up the possibilities of flexible control of thermal processes. However, the state-of-art thermal metamaterials only possess fixed and passive functionalities, and the artificial interventions of structural adjustments are also inescapable. In this paper, we propose a class of thermal logic material to overcome such long-standing problems. The proof-of-concept scheme can be created with varied configurations of shape memory alloy (SMA) and conventional thermal media. Thanks to the shape changes of SMA and multifarious medium configurations, self-adaptive switching between thermal transparency and obvious signature can be observed under appropriate working-temperature ranges of SMA with the logic operations of AND, NOR, and XOR-NOT gates. The findings provide a constructive paradigm of creating logic operations in thermal field, and might further pave the way of intelligent thermal manipulation and management with varied configurations of thermal logic gates.

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