Abstract
In this study, we demonstrated a TiO2-based 32 × 32 crossbar array resistive RAM (ReRAM), a promising candidate for next-generation non-volatile memory (NVM), by utilizing a photochemical metal-organic deposition (PMOD) process. We achieved an interface-type resistive switching device with rectifying characteristics by controlling the oxidation state of directly patterned TiOx films through post-heat treatment. The photochemical reaction induced by UV in the PMOD process and the anatase phase formation during the post-heat treatment were analyzed using Fourier-transform infrared spectroscopy, X-ray diffraction, and X-ray photoelectron spectroscopy (XPS). XPS analysis revealed the immediate formation of Ti peroxide post-PMOD process, underscoring the efficacy of post-heat treatments in controlling oxidation states. Employing 350 °C annealed TiOX as the active material, we successfully fabricated a high-yield (93%), selectorless 32 × 32 crossbar array architecture for ReRAM. Our findings highlight the PMOD process as a viable, cost-effective alternative for memory devices, offering optimized oxidation states crucial for the performance of redox-based ReRAM.
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