Abstract
Integration of electronic components and internet connectivity into devices is becoming commonplace. Flexible circuitry allows for integration without significantly altering the dimensions of these devices. Here we demonstrate the combined use of UV-laser exposure activation of a photopatternable catalytic resist deposited onto flexible glass and polyimide substrates. Metals are selectively plated onto the UV-laser activated portions of the resist. This relatively simple approach, developed by Nano3D Systems, obviates the need for physical vapor deposition, photolithography, and lift-off techniques that are normally used for fabrication of circuitry on flexible substrates.
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